1
|
DMCQSELH001981
|
8 PALLETS OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 37.5X37.5(R EV:A) H.P TRAY (149.50G.PC) ( PART#1B1-37.5-G19.35R0426) MPP O IC SHIPPING PLASTIC TRAY JED EC BGA 42.5X42.5(REV:B) H.P T RAY (121.00G.PC) (PART#1B1-42.
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-12-12
|
South Korea
|
1439 Kgs
|
8 CTN
|
2
|
DMCQSELH001749
|
6 PALLETS OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 37.5X37.5(R EV:A) H.P TRAY (149.50G.PC) ( PART#1B1-37.5-G19.35R0426) MPP O IC SHIPPING PLASTIC TRAY JED EC FC-BGA 33X33(REV:A) L.P TR AY (107.00G.PC) (PART#12Y-3333
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-12-10
|
South Korea
|
1571 Kgs
|
6 CTN
|
3
|
DMCQSELH001694
|
3 PALLETS OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 37.5X37.5(R EV:A) H.P TRAY (149.50G.PC) ( PART#1B1-37.5-G19.35R0426) MPP O IC SHIPPING PLASTIC TRAY JED EC PBGA 27X27(REV:A) L.P TRAY (118.00G.PC) (PART#125-2727-9
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-12-01
|
South Korea
|
825 Kgs
|
3 CTN
|
4
|
DMCQSELH001566
|
2 PACKAGES OF IC SHIPPING PLA STIC TRAY JEDEC BGA 37.5X37.5( REV:A) H.P TRAY (149.50G.PC) (PART#1B1-37.5-G19.35R0426) MP PO IC SHIPPING PLASTIC TRAY JE DEC BGA 42.5X42.5(REV:B) H.P TRAY (121.00G.PC) (PART#1B1-42
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-11-06
|
South Korea
|
316 Kgs
|
2 CTN
|
5
|
DMCQSELH001537
|
2 PACKAGES OF IC SHIPPING PLA STIC TRAY JEDEC BGA 37.5X37.5( REV:A) H.P TRAY (149.50G.PC) (PART#1B1-37.5-G19.35R0426) MP PO IC SHIPPING PLASTIC TRAY JE DEC FCPBGA 50X50(REV:A) H.P T RAY (135.50G.PC) (PART#1AG-505
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-10-30
|
South Korea
|
393 Kgs
|
2 CTN
|
6
|
DMCQSELH001414
|
2 PACKAGES OF IC SHIPPING PLA STIC TRAY JEDEC BGA 42.5X42.5( REV:B) H.P TRAY (121.00G.PC) (PART#1B1-42.5-H19.98P3444) MP PO IC SHIPPING PLASTIC TRAY JE DEC CSP 31X31(REV:A) L.P TRAY (105.00G.PC) 105.00G.PC) 450
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-10-14
|
South Korea
|
410 Kgs
|
2 CTN
|
7
|
DMCQSELH001349
|
6 PACKAGES OF IC SHIPPING PLA STIC TRAY JEDEC BGA 37.5X37.5( REV:A) H.P TRAY (149.50G.PC) (PART#1B1-37.5-G19.35R0426) MP PO IC SHIPPING PLASTIC TRAY JE DEC BGA 42.5X42.5(REV:B) H.P TRAY (121.00G.PC) (PART#1B1-42
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-10-10
|
South Korea
|
1176 Kgs
|
6 CTN
|
8
|
DMCQSELH001294
|
5 PACKAGES OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 37.5X37.5(R EV:A) H.P TRAY (149.50G.PC) ( PART#1B1-37.5-G19.35R0426) MPP O IC SHIPPING PLASTIC TRAY JED EC BGA 42.5X42.5(REV:B) H.P T RAY (121.00G.PC) (PART#1B1-42.
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-10-03
|
South Korea
|
1053 Kgs
|
5 CTN
|
9
|
DMCQSELH001209
|
7 PACKAGES OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 37.5X37.5(R EV:A) H.P TRAY (149.50G.PC) ( PART#1B1-37.5-G19.35R0426) MPP O IC SHIPPING PLASTIC TRAY JED EC FCPBGA 47.5X47.5(REV:A) H.P TRAY (136.00G.PC) (PART#1AG-
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-09-18
|
South Korea
|
1300 Kgs
|
7 CTN
|
10
|
DMCQSELH001130
|
3 PACKAGES OF IC SHIPPING PLAS TIC TRAY JEDEC BGA 42.5X42.5(R EV:B) H.P TRAY (121.00G.PC) ( PART#1B1-42.5-H19.98P3444) MPP O IC SHIPPING PLASTIC TRAY JED EC FCPBGA 50X50(REV:A) H.P TRA Y (135.50G.PC) (PART#1AG-5050-
|
IBM MONTREAL
|
DAEWON SEMICONDUCTOR PACKAGING IND
|
2014-09-10
|
South Korea
|
682 Kgs
|
3 CTN
|