|
1
|
CMDUSHZ7611917
|
SET,COVER,TOP,PCR ASSEMBLY,CASE,BOTTOM,RJ THICK, W ASSEMBLY,CASE,BOTTOM,NRJ THIN- , TRANSISTOR-FET,NMOSFET, V, A,DFN , P PART NO:H H H H PO :, INV: H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-11-16
|
China
|
6513 Kgs
|
471 CTN
|
|
2
|
CMDUSHZ7611916
|
SET,COVER,TOP,PCR PART NO:H PO : INV: H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS, ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-11-16
|
China
|
6443 Kgs
|
420 CTN
|
|
3
|
CMDUSHZ7591148
|
SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA, SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS,SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOMASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-10-25
|
China
|
9844 Kgs
|
650 CTN
|
|
4
|
CMDUSHZ7594033
|
DIODE,ESD, . V, A,SMD,CSP P Y,TR IC,POWER SWITCH,SOT - , P,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR IC,REDRIVER,DE MUX,WQFN, P,TR IC,CONTROLLER, . V,WLCSP, P,TR IC,BUCK-BOOST CONTROLLER, . V,VQFN,, CAPACITOR-CHIP, UF, V, M,X R, ,TR CAPACITOR-CHIP, UF, V, M,X R, ,TR, . INDUCTOR, . UH, , MHZ, MA, . X X . CAPACITOR-CHIP, UF, V, M,X R, ,TR, .CAPACITOR-AL, UF, V,M, C, . X , / CAPACITOR-CHIP, UF, V,K,X R, ,TR IC,USB TYPE-C PORT CONTROLLER,QFN, P,TR IC,USB CONTROLLER HUB, -PORT, USB . ,QFN, SET,HOLDER,A ASSEMBLY,CASE,TOP,NRJ, PART NO:H HH H H H H H H H H H H H H H H H H PO : INV:H H H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-10-25
|
China
|
13254 Kgs
|
653 CTN
|
|
5
|
CMDUSHZ7528509
|
ASSEMBLY,HUB,CAYMAN,ATTACHED,NO SD CAPACITOR-CHIP, PF, V,K,X R, ,TR, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,W TO B, . MM,ML,BLK, X , . M CONNECTOR,B TO B, . / . MM,FL,NTU, X CONNECTOR,FPC,BACK FLIP, . / . MM,FL,B TRANSISTOR-FET,NEMOS, V, A,DFN X EP,, CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,X R, ,TR CAPACITOR-CHIP- PF-K, V-X R- -TAP CAPACITOR-CHIP, PF, V,D,NP , ,TR,. CAP-CHIP- PF- V-K-X R- -TAP CAPACITOR-CHIP- . UF-M- . V-X R- -TA CAPACITOR-CHIP- . UF- . V-K-X R- -TA CAPACITOR-CHIP, . UF, V,K,X R, ,TACAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR, CAPACITOR-CHIP, UF, V,M,X R, ,TR CAPACITOR-CHIP, UF, V,K,X R, ,TR, . CAPACITOR-AL-SP, UF, . V,+ /- ,- + CONNECTOR,W TO B, . / . MM,ML,BLK, X BEAD, OHM, , A,. OHM, INCH, MHZ, INDUCTOR, . UH, , KHZ, A, . X . XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, . A, . X . CHOKE, OHM,+/- , MA, . X . X . , INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+/- , KHZ, . A, . X BEAD, OHM, , MA, . OHM, INCHBEAD, OHM, , MA, . OHM, MM, INDUCTOR, . UH,+/- , MHZ, MA, . X BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH, , KHZ, . A, . X . INDUCTOR, . UH, , KHZ, A, . X . X . BEAD, OHM,+/- , A, . OHM, MM, INDUCTOR, . UH,+- , KHZ, . X . X . M INDUCTOR, UH,+- , KHZ, A, . X . X MTRANSISTOR-FET,P-CHANNEL MOSFET,- V,- TRANSISTOR-FET,NEMOS, V, A,DFN X EP, IC,FLASH MEMORY, M,- + C, . . V, SOCKET,NANO SIM, P, . MM,GOLD FLASH, . CAPACITOR-OS, UF, . V,M, C, . X . ,L CAPACITOR-CHIP, UF, V,M,X R, ,TR, . DIODE,SCH, V, MA,SMD,SOT- ,TR DIODE,ESD, . V, A,SMD,DFN - L,TRDIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V,SMD,SLP P X J,TR CONNECTOR,FPC,BACK FLIP, . MM,FL,WHT, X RESISTOR-M/F, . , , W, ,TR TRANSISTOR-FET,NEMOS, V, MA,SC- , P, TRANSISTOR-FET,PEMOS,- V,- . A,SOT , P TRANSISTOR-FET,DUAL NMOSFET, V, . A,SOIC,POWER SWITCH,SOT , P,TR IC,TEMPERATURE SENSOR,MSOP, P,TR IC,USB TYPE-C PD CONTROLLER, . V,VQFN, IC,SYNC STEP-DOWN REGULATOR, . VV, DIODE,SCH, V, MA,SMD,SOT- ,TR TRANSISTOR-FET,NEMOS, V, MA,SOT- , P TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P SET,BOTTOM COVER,ASET,BCS,LENS,D,PMMA SET,A COVER,DOOR,W/O FINGER,W/O PAYMENT, SET,BEZEL STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= CLIP,PCB, . MM, MM, . MM,SUSFOAM,P , MM, MM, . MM,THICK FOAM,CR , MM, MM, . MM,WWAN -ROLL S BUMPER, . MM, . MM, . MM,SILICONE RUBB BUMPER, MM, . MM, . MM,SILICONE RUBBER INSULATOR,BRKT CPU,AMD,TS- -HB, FFC, P CLICK, X . X . MM, . / . MM,PET FFC, P ECOM, X . X . MM, . / . MM,PET, SPEAKER.W/HOUSING, OHM, W, X , X . XBUTTON,BOTTOM COVER,PC+ABS+ TALC LATCH,BOTTOM COVER,POM LENS,BCS,WINDOW,PMMA,TOP DOOR,DUMMY,SIM,C ,WHITE LENS,BCS,WINDOW,PMMA,BOT CABLE,ROUND+FPC, POS, MM,I,EDP,TOP,PR SPEAKER.W/HOUSING, OHM, W, X , . X DOOR,DUMMY,SIM,C ,BLACKHOLDER,CAMERA,PC+ABS FRAME,TOP,POWER,PCFR E, DUMMY,TOP,PEN,PC+ABS+ TALC, X BRACKET,THERMAL,CPU,SUS BRACKET,TOP,KEYBOARD,SGCC, COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X SHIELD,ASIDE,ABSORBER,DST- , ,MYLARPCB,LAN, L,FR ,HALOGEN FREE+ ROHS PCB,MB, L,FR ,HALOGEN FREE+ ROHS PCB,HUB, L, . X X . MM,FR ,HALOGEN FRE PCB,SC, L, . X . X . MM,FR ,HALOGEN FR PCB,USB, L,FR ,HALOGEN FREE+ ROHS PCB,ECOM, L, . X X . MM,FR ,HALOGEN FRE TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
N/A
|
2025-10-12
|
China
|
9692 Kgs
|
609 CTN
|
|
6
|
CMDUSHZ7461581
|
ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6462 Kgs
|
486 CTN
|
|
7
|
CMDUSHZ7461583
|
ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
7595 Kgs
|
488 CTN
|
|
8
|
CMDUSHZ7461579
|
RESISTOR-CHIP, K, , / W, ,TR IC,HUB CONTROLLER,USB . , QFN, P,TR TRANSISTOR-FET,PEMOS, V, MA,SOT , P, DIODE,SCH, V, . A, MW,SMT,, SOT- ,TR BEAD, OHM, , . A, . OHM, INCH, IC,THERMAL SENSOR,ONE, BIT ADC,SOT- , P IC,TEMPERATURE SENSOR, SOT - , P,TR IC,PROTECTION DEVICE,ESD, V,DFN X - L, DIODE-ZNR, . V, . MA, MW,SMD, SOD ,TR TRANSISTOR-FET,PEMOS,- V,- A, DFN X , P DIODE,ESD, V, A, W,SMD, SLP P X F,TR DIODE,ESD, . V, A,SMD,DFN P E,TRDIODE,ESD, . V,SMD,DFN P X,TR IC,ANALOG SWITCH,UQFN, P,TR ASSEMBLY,CASE,BOTTOM,SUB, RJ THICK, W ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON PART NO:H H H HH H H H H H H H H H H H H H H PO : INV:H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6360 Kgs
|
508 CTN
|
|
9
|
CMDUCHN2529205
|
SET,BEZEL,DISPLAY,IR, W SET,BEZEL,DISPLAY, W,IR CABLE,ROUND, POS, MM,E,MDP TO DP ADAP FAN,BLOWER, . X . X . MM, . CFM, . FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H H H PO :INV: H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6745 Kgs
|
22 PKG
|
|
10
|
CMDUCHN2529193
|
ASSEMBLY,TOP,THICK RJ ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, MM CLIP, . MM, . MM, . MM,SUS / H,H= ., CLIP, . MM, . MM, . MM,SUS / H,H= FRAME,SHIELDING,C ,R SHIELD,CPU INL,KU S, N, SHIELD,CPU INL,KU S, N, CABLE,ROUND, POS, MM,E,TBT COMBO PCB,SMART CARD, L,HALONGFREE,ENTEK PCB,ECOM, L,FR ,ENTEK PART NO:H H H H H H H H H H H H H H H H H PO : INV: H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6776 Kgs
|
23 PKG
|
