|
1
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CMDUSHZ7528509
|
ASSEMBLY,HUB,CAYMAN,ATTACHED,NO SD CAPACITOR-CHIP, PF, V,K,X R, ,TR, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,W TO B, . MM,ML,BLK, X , . M CONNECTOR,B TO B, . / . MM,FL,NTU, X CONNECTOR,FPC,BACK FLIP, . / . MM,FL,B TRANSISTOR-FET,NEMOS, V, A,DFN X EP,, CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,X R, ,TR CAPACITOR-CHIP- PF-K, V-X R- -TAP CAPACITOR-CHIP, PF, V,D,NP , ,TR,. CAP-CHIP- PF- V-K-X R- -TAP CAPACITOR-CHIP- . UF-M- . V-X R- -TA CAPACITOR-CHIP- . UF- . V-K-X R- -TA CAPACITOR-CHIP, . UF, V,K,X R, ,TACAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR, CAPACITOR-CHIP, UF, V,M,X R, ,TR CAPACITOR-CHIP, UF, V,K,X R, ,TR, . CAPACITOR-AL-SP, UF, . V,+ /- ,- + CONNECTOR,W TO B, . / . MM,ML,BLK, X BEAD, OHM, , A,. OHM, INCH, MHZ, INDUCTOR, . UH, , KHZ, A, . X . XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, . A, . X . CHOKE, OHM,+/- , MA, . X . X . , INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+/- , KHZ, . A, . X BEAD, OHM, , MA, . OHM, INCHBEAD, OHM, , MA, . OHM, MM, INDUCTOR, . UH,+/- , MHZ, MA, . X BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH, , KHZ, . A, . X . INDUCTOR, . UH, , KHZ, A, . X . X . BEAD, OHM,+/- , A, . OHM, MM, INDUCTOR, . UH,+- , KHZ, . X . X . M INDUCTOR, UH,+- , KHZ, A, . X . X MTRANSISTOR-FET,P-CHANNEL MOSFET,- V,- TRANSISTOR-FET,NEMOS, V, A,DFN X EP, IC,FLASH MEMORY, M,- + C, . . V, SOCKET,NANO SIM, P, . MM,GOLD FLASH, . CAPACITOR-OS, UF, . V,M, C, . X . ,L CAPACITOR-CHIP, UF, V,M,X R, ,TR, . DIODE,SCH, V, MA,SMD,SOT- ,TR DIODE,ESD, . V, A,SMD,DFN - L,TRDIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V,SMD,SLP P X J,TR CONNECTOR,FPC,BACK FLIP, . MM,FL,WHT, X RESISTOR-M/F, . , , W, ,TR TRANSISTOR-FET,NEMOS, V, MA,SC- , P, TRANSISTOR-FET,PEMOS,- V,- . A,SOT , P TRANSISTOR-FET,DUAL NMOSFET, V, . A,SOIC,POWER SWITCH,SOT , P,TR IC,TEMPERATURE SENSOR,MSOP, P,TR IC,USB TYPE-C PD CONTROLLER, . V,VQFN, IC,SYNC STEP-DOWN REGULATOR, . VV, DIODE,SCH, V, MA,SMD,SOT- ,TR TRANSISTOR-FET,NEMOS, V, MA,SOT- , P TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P SET,BOTTOM COVER,ASET,BCS,LENS,D,PMMA SET,A COVER,DOOR,W/O FINGER,W/O PAYMENT, SET,BEZEL STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= CLIP,PCB, . MM, MM, . MM,SUSFOAM,P , MM, MM, . MM,THICK FOAM,CR , MM, MM, . MM,WWAN -ROLL S BUMPER, . MM, . MM, . MM,SILICONE RUBB BUMPER, MM, . MM, . MM,SILICONE RUBBER INSULATOR,BRKT CPU,AMD,TS- -HB, FFC, P CLICK, X . X . MM, . / . MM,PET FFC, P ECOM, X . X . MM, . / . MM,PET, SPEAKER.W/HOUSING, OHM, W, X , X . XBUTTON,BOTTOM COVER,PC+ABS+ TALC LATCH,BOTTOM COVER,POM LENS,BCS,WINDOW,PMMA,TOP DOOR,DUMMY,SIM,C ,WHITE LENS,BCS,WINDOW,PMMA,BOT CABLE,ROUND+FPC, POS, MM,I,EDP,TOP,PR SPEAKER.W/HOUSING, OHM, W, X , . X DOOR,DUMMY,SIM,C ,BLACKHOLDER,CAMERA,PC+ABS FRAME,TOP,POWER,PCFR E, DUMMY,TOP,PEN,PC+ABS+ TALC, X BRACKET,THERMAL,CPU,SUS BRACKET,TOP,KEYBOARD,SGCC, COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X SHIELD,ASIDE,ABSORBER,DST- , ,MYLARPCB,LAN, L,FR ,HALOGEN FREE+ ROHS PCB,MB, L,FR ,HALOGEN FREE+ ROHS PCB,HUB, L, . X X . MM,FR ,HALOGEN FRE PCB,SC, L, . X . X . MM,FR ,HALOGEN FR PCB,USB, L,FR ,HALOGEN FREE+ ROHS PCB,ECOM, L, . X X . MM,FR ,HALOGEN FRE TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
N/A
|
2025-10-12
|
China
|
9692 Kgs
|
609 CTN
|
|
2
|
CMDUSHZ7461581
|
ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6462 Kgs
|
486 CTN
|
|
3
|
CMDUSHZ7461583
|
ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
7595 Kgs
|
488 CTN
|
|
4
|
CMDUSHZ7461579
|
RESISTOR-CHIP, K, , / W, ,TR IC,HUB CONTROLLER,USB . , QFN, P,TR TRANSISTOR-FET,PEMOS, V, MA,SOT , P, DIODE,SCH, V, . A, MW,SMT,, SOT- ,TR BEAD, OHM, , . A, . OHM, INCH, IC,THERMAL SENSOR,ONE, BIT ADC,SOT- , P IC,TEMPERATURE SENSOR, SOT - , P,TR IC,PROTECTION DEVICE,ESD, V,DFN X - L, DIODE-ZNR, . V, . MA, MW,SMD, SOD ,TR TRANSISTOR-FET,PEMOS,- V,- A, DFN X , P DIODE,ESD, V, A, W,SMD, SLP P X F,TR DIODE,ESD, . V, A,SMD,DFN P E,TRDIODE,ESD, . V,SMD,DFN P X,TR IC,ANALOG SWITCH,UQFN, P,TR ASSEMBLY,CASE,BOTTOM,SUB, RJ THICK, W ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON PART NO:H H H HH H H H H H H H H H H H H H H PO : INV:H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6360 Kgs
|
508 CTN
|
|
5
|
CMDUCHN2529205
|
SET,BEZEL,DISPLAY,IR, W SET,BEZEL,DISPLAY, W,IR CABLE,ROUND, POS, MM,E,MDP TO DP ADAP FAN,BLOWER, . X . X . MM, . CFM, . FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H H H PO :INV: H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6745 Kgs
|
22 PKG
|
|
6
|
CMDUCHN2529193
|
ASSEMBLY,TOP,THICK RJ ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, MM CLIP, . MM, . MM, . MM,SUS / H,H= ., CLIP, . MM, . MM, . MM,SUS / H,H= FRAME,SHIELDING,C ,R SHIELD,CPU INL,KU S, N, SHIELD,CPU INL,KU S, N, CABLE,ROUND, POS, MM,E,TBT COMBO PCB,SMART CARD, L,HALONGFREE,ENTEK PCB,ECOM, L,FR ,ENTEK PART NO:H H H H H H H H H H H H H H H H H PO : INV: H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6776 Kgs
|
23 PKG
|
|
7
|
CMDUCHN2529191
|
SET,BEZEL,DISPLAY,IR, P SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= BRACKET,TOP,SMART CARD,KU S,AUTO, TOUCH PAD,NO BUTTON, P, . X ,PIKE SIL SPEAKER.W/HOUSING, OHM, . W, X , . X HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , X . KEYBOARD MODULE, ,USB,JACK BLACK,US, SPEAKER.W/HOUSING, OHM, W, X , . XSPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X .SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . THERMAL MODULE,INTEL ARL,UMA, W,CHIPSET SET,TOP,HOUSING SET,FRAME,BTM,MWSSET,BEZEL,DISPLAY,IR, P DUMMY,SMART CARD,TOP,PC+ABS+ TALC, FRAME,TOP,KEYBOARD,PC+ABS+ TALC,UK, HOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,TOP,IO R,PC+ABS TALC, P BUTTON,TOP FPR,PC, P FAN,BLOWER, . . . MM, . CFM, . SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,I,M . , . MM,MACH, . MM,. MM,CROSS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,PAN,M . , . MM,MACH, . MM, . MM,CR SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, SCREW,I,M . , . MM,MACHINE, . MM, . MM, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS PAD, MM, MM, . MM,DENKA BSNA SHIELD,PCB,MAIN,ABSORBER, GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESIGASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR,. CAPACITOR-TA-SP, UF, . V,M,- + C, DIODE,RECT, V, A,SMD,SOD- FL,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RES-CHIP- . K- - / W- -TAP RES-CHIP- K- - / W- -TAP RESISTOR-CHIP, . K, , / W, ,TAP RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, . , , / W, ,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, K, , / W, . A, ,TR RESISTOR-CHIP, ,+/- , / W, ,TR RESISTOR-CHIP, ,+/- , / W, ,TAPRESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, K,+/- , / W, ,TAP RESISTOR-CHIP, ,+/- , / W, ,TR,+/- RESISTOR-CHIP, ,+/- , / W, ,TR,+/ RESISTOR-CHIP, . ,+/- , W, ,TR,+/- RESISTOR-CHIP, . K,+/- , / W, ,TR INDUCTOR, . UH, , KHZ, A, . X XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M INDUCTOR, . UH,+/- , KHZ, . A, . X . BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, . A, . X . CRYSTAL, MHZ, PPM, PF,SMD, . X . X . CRYSTAL, . KHZ,+/- PPM, . PF,SMD, .CRYSTAL, MHZ,+/- PPM, PF,SMD, . X . X CRYSTAL, . MHZ,+/- PPM, PF,SMD, . X . IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,FLASH MEMORY, M,- + C, . . V, IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TRCAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR DIODE,RECT, V, A,SMD,SOD- FL,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , .BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X TRANSISTOR-FET,NEMOS, V, A,DFN X , P,IC,FLASH MEMORY, M,- + C, . . V, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . TRANSISTOR-FET,PEMOS,- V, A,SOT- , P,T IC,ANALOG MUX/DEMUX,X - DFN - , P,TR DIODE,ESD, V,SMD,SOD ,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,FPC,BACK FLIP, . / . MM,FL,NTU RESISTOR-CHIP, . ,+- , W, ,TRRESISTOR-CHIP, . ,+/- , W, ,TR,+- IC,MICROPOWER HALL SWITCH,TSOT - L, P,T IC,AND GATE, . . V, INPUT,SINGLE,TSSO BEAD, OHM, , MA, . OHM, INCH, IC,TEMPERATURE SENSOR,MSOP, P,TR ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETS( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
8350 Kgs
|
26 PKG
|
|
8
|
CMDUCHN2529218
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SCREW,I,M . , . MM,P, . MM, . MM,TORX/SL FRAME,BOTTOM,LNL-SUP,PC+ABS TALC, P FRAME,BOTTOM,LNL,SUP,PC+ABS TALC, ,Z DUMMY,SMART CARD,TOP,PC+ABS, + TALC, W BUTTON,TOP,POWER,PCFR E+TIO , GRAY SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SHIELD,CAN DDR,WLAN, SUS , W THERMAL MODULE,AMD FP , W,CHIPSET DOWN BRACKET,TOP,KEYBOARD,SGCC, LNL MOUSE,USB, B+WHEEL,OPTICAL, BLACK TOUCH PAD,NO BUTTON, P, X . ,PIKE S KEYBOARD, ,BL, P,SOFT GREY,USA, . X KEYBOARD, ,BL, P,BLACK,CAN-FR / MULTI,ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM TRANSISTOR-FET,NNEMOS, V, / A,DFN, P, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-TA-SP, UF, V,M, C,BX . ,SM IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,REPEATER/LEVEL SHIFTER, . GBPS,HDMI,IC,PROTECTION DEVICE, V,FLAT-CLAMP SURG IC,LOAD SWITCH, . . V, A,DSBGA, P,TR IC,TEMPERATURE SENSOR, . . V,VSSOP, P, CAPACITOR-CHIP, PF, V,K,NP , ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, UF, V,K,X S, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TRCAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . PF, V,B,C G, ,TR, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR,CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,C,C G, ,TR, . INDUCTOR, . UH, , KHZ, A, . X X BEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH,+/- , MHZ, MA, . X .INDUCTOR, . UH,+/- , MHZ, . A, . X . INDUCTOR, . UH,+/- , MHZ, . A, . X . X INDUCTOR, . UH,+- , KHZ, A, . X . X INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+- , MHZ, . A, . X . X INDUCTOR, . UH,+- , MHZ, A, . X . X . INDUCTOR, . UH,+- , KHZ, A, . X . X BEAD, OHM, , A, . OHM, INCH,IC,FLASH MEMORY, M,- + C, . . V, IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR,CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X .INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X IC,FLASH MEMORY, M,- + C, . . V, IC,TEMPERATURE SENSOR,MSOP, P,TR CAPACITOR-TA-SP, UF, . V,M,- + C, HINGE-W BRACKET,DISPLAY,LEFT, . MM, . HINGE-W BRACKET,DISPLAY,RIGHT, . MM, . HOLDER,BOTTOM IO,RIGHT,PC+ABSFAN,BLOWER, X X . MM, . CFM, . PA, MOUSE,USB, BUTTON,OPTICAL,BLACK PLATE,BACKING,CPU,SGCC BRACKET,MEMS,MIC,SGCC COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X COVER,DISPLAY HINGE,LEFT,RAL ,WLAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN,HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF DIB,PEN,BLACK CABLE,ROUND, POS, MM,I,BASE GPIO CABLE,ROUND+FPC, POS, MM,I,HUB CABLE,FLAT, POS, MM,I,BASE HIGH SPEED CABLE,ROUND+FFC, POS, MM,I,CAMERA,ACS CAPACITOR-TANT, UF, V, ,- + C, .PART NO: H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USAAS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTACLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
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HP INC. C/O INVENTEC (CHONGQING)
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2025-09-04
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China
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8962 Kgs
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22 PKG
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9
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CMDUCHN2529206
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TOUCH PAD,NO BUTTON, P, . X . ,GLAC DUMMY,SIM,PC+ABS+ TALC, CABLE,ROUND+FFC, POS, MM, I,CAMERA,ACS ASSEMBLY,CASE,BOTTOM,W/O, RJ , N, PART NO: H H H H H PO : INV: H H HH H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE,PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALOALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
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HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
9469 Kgs
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22 PKG
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|
10
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CMDUCHN2529223
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ASSEMBLY,CASE,REAR,DISPLAY, WLAN, X ASSEMBLY,CASE,DISPLAY,KIT, METEOR ASSEMBLY,CASE,REAR,DISPLAY, WWAN, X ASSEMBLY,CASE,REAR,DISPLAY,, WLAN,THICK, ASSEMBLY,TOP,W/O,KEYBOARD, SUB,RJ , ASSEMBLY,CASE,BOTTOM,W/O RJ , P PART NO: H H H H H HH H H H PO : INV:H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-09-04
|
China
|
6528 Kgs
|
21 PKG
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