1
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK3600GHR 16*6.5)EPOXY MOLDING COMPOUND
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2025-06-06
|
CHINA
|
3495 KGS
|
2
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45) EPOXY MOLDING COMPOUND
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2025-06-06
|
CHINA
|
495 KGS
|
3
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-11-02
|
CHINA
|
6000.00 KGS
|
4
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45)(NCV)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-11-02
|
CHINA
|
30.00 KGS
|
5
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK3600GHR 16*6.5)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-11-02
|
CHINA
|
1995.00 KGS
|
6
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-08-01
|
CHINA
|
3990.00 KGS
|
7
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-07-08
|
CHINA
|
3990.00 KGS
|
8
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GH 43*45 )(SAMPLE) (NCV)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-07-08
|
CHINA
|
75.00 KGS
|
9
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK3600GHR 16 *6.5)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-07-08
|
CHINA
|
600.00 KGS
|
10
|
EPOXY MOLDING COMPOUND FOR ENCAPSULATION (EK1700GHR 16*6.5)
|
CONTINENTAL DEVICE INDIA PRIVATE LIMITED
|
ETERKON SEMICONDUCTOR MATERIALS CO.
|
2024-01-05
|
CHINA
|
1965.00 KGS
|