|
1
|
SEINSOATL25I1676
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-10-29
|
Japan
|
2174 Kgs
|
120 PKG
|
|
2
|
KWEO560240096460
|
SOLDER WIRE (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-27
|
Malaysia
|
2064 Kgs
|
4 WDC
|
|
3
|
YASVPRG0029291
|
BRAZING MATERIAL HYBRAZ MB HS: INV: FV , FV UN TOXIC LIQUID, PG , CLASS , KG
|
HARIMATEC, INC.
|
HARIMATEC CZECH S R O
|
2025-10-23
|
Germany
|
2613 Kgs
|
3 PAL
|
|
4
|
FLEQ01IPH0057669
|
WOODEN CASES OF SOLDER POWDER SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-10
|
Singapore
|
1075 Kgs
|
2 CAS
|
|
5
|
KWEO560240095686
|
SOLDER WIRE AND SOLDER POWDER HS CODE: . . , . . & . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-09-27
|
Malaysia
|
757 Kgs
|
2 WDC
|
|
6
|
SEINSOATL25H0441
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE : . , . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-09-24
|
Japan
|
2061 Kgs
|
104 PKG
|
|
7
|
KWEO560240095605
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-09-21
|
Malaysia
|
3210 Kgs
|
14 WDC
|
|
8
|
KWEO560240095082
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-09-06
|
Malaysia
|
419 Kgs
|
2 WDC
|
|
9
|
SHPT90519230
|
POWDER HS CODE SOLDER POWDER
|
HARIMATEC INC
|
INDUSTRIE DES POUDRES SPHERIQUES
|
2025-08-31
|
France
|
2920 Kgs
|
56 PKG
|
|
10
|
SEINSOATL25G1814
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-08-29
|
Japan
|
1821 Kgs
|
92 PKG
|