|
1
|
KWEO560240098862
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-31
|
Malaysia
|
2047 Kgs
|
9 WDC
|
|
2
|
SEINSOATL25K0903
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: . , . , . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-12-28
|
Japan
|
2200 Kgs
|
112 PKG
|
|
3
|
FLEQ01IPH0058644
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-21
|
Singapore
|
576 Kgs
|
2 CAS
|
|
4
|
FLEQ01IPH0058539
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
509 Kgs
|
1 CAS
|
|
5
|
FLEQ01IPH0058424
|
SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
532 Kgs
|
1 CAS
|
|
6
|
SEINSOATL25J1686
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-12-03
|
Japan
|
2113 Kgs
|
502 PKG
|
|
7
|
KWEO560240097624
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-01
|
Malaysia
|
1387 Kgs
|
7 WDC
|
|
8
|
FLEQ01IPH0058015
|
SOLDER WIRES & SOLDER POWDER SOLDER WIRES (SILVER - SEMI MANUFACTURED) & SOLDER WIRES (ELECTRODES)
|
HARIMATEC INC.
|
HARIMATEC MALAYSIA SDN BHD
|
2025-11-24
|
Singapore
|
1426 Kgs
|
4 CAS
|
|
9
|
SHPT90527838
|
SOLDER POWDER DANGEROUS SOLDER POWDER NON DANGEROUS HS CODE
|
HARIMATEC INC
|
IPS INDUSTRIE DES POUDRES
|
2025-11-21
|
France
|
3320 Kgs
|
46 PKG
|
|
10
|
SEINSOATL25I1676
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : . , .
|
HARIMATEC.INC.
|
HARIMA CHEMICALS, INC.
|
2025-10-29
|
Japan
|
2174 Kgs
|
120 PKG
|