|
1
|
KWEO560240098862
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-31
|
Malaysia
|
2047 Kgs
|
9 WDC
|
|
2
|
FLEQ01IPH0058644
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES)
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-21
|
Singapore
|
576 Kgs
|
2 CAS
|
|
3
|
FLEQ01IPH0058539
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES)
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
509 Kgs
|
1 CAS
|
|
4
|
FLEQ01IPH0058424
|
SOLDER WIRES (ELECTRODES)
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-10
|
Singapore
|
532 Kgs
|
1 CAS
|
|
5
|
KWEO560240097624
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-12-01
|
Malaysia
|
1387 Kgs
|
7 WDC
|
|
6
|
FLEQ01IPH0058015
|
SOLDER WIRES & SOLDER POWDER SOLDER WIRES (SILVER - SEMI MANUFACTURED) & SOLDER WIRES (ELECTRODES)
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-11-24
|
Singapore
|
1426 Kgs
|
4 CAS
|
|
7
|
KWEO560240096460
|
SOLDER WIRE (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . .
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-27
|
Malaysia
|
2064 Kgs
|
4 WDC
|
|
8
|
FLEQ01IPH0057669
|
WOODEN CASES OF SOLDER POWDER SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-10-10
|
Singapore
|
1075 Kgs
|
2 CAS
|
|
9
|
KWEO560240095686
|
SOLDER WIRE AND SOLDER POWDER HS CODE: . . , . . & . .
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-09-27
|
Malaysia
|
757 Kgs
|
2 WDC
|
|
10
|
KWEO560240095605
|
LIQUID FLUX HS CODE: . .
|
HARIMATEC, INC
|
HARIMATEC MALAYSIA SDN BHD
|
2025-09-21
|
Malaysia
|
3210 Kgs
|
14 WDC
|